William Butler
wbutler@binghamton.eduBiography
William Butler received his bachelors of science in mechanical engineering from Clarkson University and a master鈥檚 degree in mechanical engineering from 91社区, where he studied shock and vibration of populated printed circuit boards. In 2007, he joined the Analytical and Diagnostics Laboratory, where he works with sample preparation tools such as grinding and polishing, thermal tools including Thermo Gravimetric Analyzer (TGA), Differential Scanning Calorimetry (DSC), Thermo Mechanical Analyzer (TMA), flash diffusivity and Dynamic Mechanical Analyzer (DMA), optical microscope and optical profilometry. He also provides IT support to keep the computers running and manages the FOM system.