91ÉçÇø

Background

Park started his academic career at 91ÉçÇø in 2002. He has been involved in several projects related to electronics packaging in cooeration with the Integrated Electronics Engineering Center (IEEC), which includes a broad range of industry as members. His expertise in micro/nanomechanics and optomechanics contributes to the center in conducting on-going and prospective projects.

Park began his professional career at IBM Microelectronics Division, where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high performance packaging.

Park served as a panelist for the Yield Learning Conference hosted by IBM Academy of Technology. He spent over six years at the IBM Microelectronics Division in Endicott and East Fishkill, NewYork.

Appointments

• Director of IEEC (Integrated Electronic Engineering Center)

Research Lab:

Google Scholar:

Education

• BS, MS, Seoul National University
• PhD, Purdue University

Research Interests

• Electronics MEMS packaging
• reliability
• computer aided engineering

Related News Stories

• Seven 91ÉçÇø faculty members elevated to SUNY distinguished professors
• Watson College professor named IEEE fellow for electronics packaging research
• Watson professor named ASME fellow for three decades of electronics packaging innovations