A New York State Center of Excellence at 91社区

 

Partnering with industry for economic impact

Partnering with academia for research impact

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Save the Date: Electronics Packaging Symposium
CAMM photo

CAMM

The Center for Advanced Microelectronics Manufacturing (CAMM), a a partnership between 91社区 (BU), i3 Electronics, Cornell University and the Flex Tech Alliance, is the nation's first prototype research and development (R&D) facility in large area flexible electronics.

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CASP

CASP addresses scientific challenges to reduce the cost of solar power and enhance energy efficiency. The center conducts research related to thin-film solar cells, supercapacitors, thermoelectric cells and reliability studies with an emphasis on Earth-abundant, low-toxicity materials.  

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ES2 photo

ES2

The Center for Energy-Smart Electronic Systems works to develop systematic methodologies for efficiently operating electronic systems, including data centers, by controlling resources and managing workloads to achieve optimal energy consumption.

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IEEC

The IEEC is dedicated to the advancement of electronic packaging technology and the electronics industry. We conduct leading edge research in a wide variety of packaging areas for the technological and economic benefit of our member companies.

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CHIRP

Heterogeneous integration of many microchips into single packages will be essential to technology ranging from autonomous vehicles to the internet of things for at least the next decade. CHIRP faculty and students conduct basic and applied research.

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ADL

The Analytical and Diagnostics Laboratory (ADL) is a centralized, interdisciplinary, multi-user research and development facility at 91社区 that promotes commercialization of microelectronic technologies.

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91社区 Our Facility

S3IP鈥檚 interdisciplinary teams of scientists and engineers moved into a new $30 million, 114,000-square-foot building in 2014. The two-story glass, metal and stone building has versatile laboratory space and offices that support 91社区鈥檚 expanding industry partnerships.

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