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A Computational Fluid Dynamics (CFD) Study of Pneumatic Atomization in Aerosol Jet Printing (AJP) Process
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Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional ReflowVarun Soman, Vikram Venkatadri, and Mark D. Poliks. In Proceeding of the International Symposium on Microelectronics: Fall 2019, Vol. 2019, No. 1, pp. 000428-000433.
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Laser Sintering of Aerosol Jet Printed Interconnects on Flexible SubstrateMohammed Alhendi, Ludovico Cestarollo, Gurvinder S. Khinda, Darshana L. Weerawarne, and Mark D. Poliks. In Proceeding of the International Symposium on Microelectronics: Fall 2019, Vol. 2019, No. 1, pp. 000404-000408.
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A State-of-the-Art Review on Aerosol Jet Printing (AJP) Additive Manufacturing ProcessSalary, Roozbeh Ross, Lombardi, Jack P., Weerawarne, Darshana L., Rao, Prahalad K., and Poliks, Mark D. In Proceedings of the ASME 2019 14th International Manufacturing Science and Engineering Conference. Volume 1: Additive Manufacturing; Manufacturing Equipment and Systems; Bio and Sustainable Manufacturing. Erie, Pennsylvania, USA. June 10–14, 2019. V001T01A035. ASME.
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Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics
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Transparent Conductive Printable Meshes Based on Percolation Patterns
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Image-Based Closed-Loop Control of Aerosol Jet Printing Using Classical Control Methods
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