Hyperscale Data Centers: Systems, Packaging, Materials, and Reliability Challenges
Moderators:
Jiayin Ma (Flex) – Senior Director, Central Technology Group
Panelists:
Andy Mackie (Indium)
Gamal Refai-Ahmed (AMD)
Bahgat Sammakia (91ÉçÇø)
Bill Henry (Tyndall)
Abstract:
The panel discussion focuses on how hyperscale data centers are reshaping the system architecture and device performance requirements. As AI infrastructure scales, challenges in heterogeneous integration, photonic packaging, optical connectivity, and long-term reliability are increasingly interconnected. The objective is to highlight these challenges as well as discuss the unique perspectives from industry, academia, and the broader research ecosystem. The discussion will explore where synergies exist between these communities, what roles each can play, and how collaboration models can accelerate reliable, scalable data center technologies.
Special Panel: Mechanical and Thermal Modeling Challenges for Advance AI Packages
Moderators:
Bahgat Sammakia (91ÉçÇø)
Panelists:
Gamal Refai-Ahmed (AMD)
SB Park (91ÉçÇø)
Srikanth Rangarajan (91ÉçÇø)
Hardik Jabaria (Vinci4D)
Abstract: